HomeSmart & Intelligent Packaging Co-Packaged Optics (CPO) Market

United States Co-Packaged Optics (CPO) Market Size & Outlook, 2025-2033


United States Co-Packaged Optics (CPO) Market Insights

  • As per Packaging Market Insights, the United States Co-Packaged Optics (CPO) Market stood at USD 26.86 Million in 2024 and is anticipated to grow to USD 297.35 Million by 2033.
  • The United States market is expected to advance at a CAGR of 30.34% from 2026 through 2033.
  • In 2024, Lasers accounted for the highest share of the By Component market size.
  • During the forecast period, Lasers is set to register the highest growth, making it the most lucrative By Component segment.

Other Key Findings


  • United States contributed 28.33% to the global Co-Packaged Optics (CPO) Market size in 2024.
  • By 2033, United States is forecasted to remain the largest global market for Co-Packaged Optics (CPO) Market.
  • In North America, United States is projected to capture the leading share of market size by 2033.
  • Among North America markets, United States is expected to post the fastest growth, reaching USD 291.72 Million by 2033.

Report Summary

Report Scope Details
Base Year for Study 2024
Study Period 2021-2033
Historical Period 2021-2023
Forecast Period 2025-2033
Market Size In 2024 USD 26.86 Million
Market Size In 2033 USD 297.35 Million
Largest segment Lasers
Units Revenue in USD Million
CAGR 30.34% (2025-2033)
Segmnetation Covered
By Component
  1. Optical engines/transceivers
  2. Photonic integrated circuits (PICs)
  3. Lasers
  4. Modulators
  5. Electrical ICs / SerDes
  6. Optical fibers and waveguides
  7. Connectors and interfaces
  8. Thermal management solutions
  9. Packaging substrates and interposers
  10. Testing and alignment tools
By Integration / Packaging Type
  1. True co-packaged optics (same package as ASIC)
  2. Co-located optics (adjacent module integration)
  3. On-board optics (PCB-level integration)
By Reach / Interconnect Length
  1. Intra-package / intra-die (<10 mm)
  2. Intra-rack / intra-chassis (10 mm–3 m)
  3. Inter-rack / data-hall (3 m–100 m)
By End-Use Application
  1. Hyperscale data centers (AI/cloud)
  2. AI-Driven High-Performance Computing (HPC)
  3. Enterprise data centers
  4. Telecom and metro networks
  5. Edge data centers
By Distribution Channel
  1. Direct OEM / hyperscaler supply
  2. Channel / distributor-based sales
  3. Contract manufacturing partnerships
Report Coverage Revenue Forecast, Competitive Landscape, Growth Factors, Environment & Regulatory Landscape and Trends

Tags:

Connected Packaging Temperature Monitoring

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