South East Asia Co-Packaged Optics (CPO) Market Size & Outlook, 2025-2033
South East Asia Co-Packaged Optics (CPO) Market Insights
- As per Packaging Market Insights, the South East Asia Co-Packaged Optics (CPO) Market stood at USD 1.42 Million in 2024 and is anticipated to grow to USD 14.66 Million by 2033.
- The South East Asia market is expected to advance at a CAGR of 29.53% from 2026 through 2033.
- In 2024, Optical engines/transceivers accounted for the highest share of the By Component market size.
- During the forecast period, Modulators is set to register the highest growth, making it the most lucrative By Component segment.
Source: PIAnalysis Company Publications, Primary Interviews.
Other Key Findings
- South East Asia accounted for 1.5% of the global Co-Packaged Optics (CPO) Market size in 2024.
- By 2033, United States is expected to remain the top global market in terms of size.
- Within Asia Pacific, China is forecasted to dominate the regional Co-Packaged Optics (CPO) Market size by 2033.
- Australia will be the fastest-growing market in Asia Pacific, projected to achieve USD 9.76 Million by 2033.
Report Summary
| Report Scope | Details |
|---|---|
| Base Year for Study | 2024 |
| Study Period | 2021-2033 |
| Historical Period | 2021-2023 |
| Forecast Period | 2025-2033 |
| Market Size In 2024 | USD 1.42 Million |
| Market Size In 2033 | USD 14.66 Million |
| Largest segment | Optical engines/transceivers |
| Units | Revenue in USD Million |
| CAGR | 29.53% (2025-2033) |
| Segmnetation Covered | |
| By Component |
|
| By Integration / Packaging Type |
|
| By Reach / Interconnect Length |
|
| By End-Use Application |
|
| By Distribution Channel |
|
| Report Coverage | Revenue Forecast, Competitive Landscape, Growth Factors, Environment & Regulatory Landscape and Trends |
South East Asia Co-Packaged Optics (CPO) Market By Component 2025-2033 (USD Million)
| By Component | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 | 2027 | 2028 | 2029 | 2030 | 2031 | 2032 | 2033 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Optical engines/transceivers | XX.x | XX.x | XX.x | 0.32 | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Photonic integrated circuits (PICs) | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Lasers | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Modulators | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Electrical ICs / SerDes | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Optical fibers and waveguides | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Connectors and interfaces | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Thermal management solutions | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Packaging substrates and interposers | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Testing and alignment tools | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Total | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
Source: PIAnalysis Company Publications, Primary Interviews.
South East Asia Co-Packaged Optics (CPO) Market By Integration / Packaging Type 2025-2033 (USD Million)
| By Integration / Packaging Type | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 | 2027 | 2028 | 2029 | 2030 | 2031 | 2032 | 2033 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| True co-packaged optics (same package as ASIC) | XX.x | XX.x | XX.x | 0.77 | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Co-located optics (adjacent module integration) | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| On-board optics (PCB-level integration) | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Total | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
Source: PIAnalysis Company Publications, Primary Interviews.
South East Asia Co-Packaged Optics (CPO) Market By Reach / Interconnect Length 2025-2033 (USD Million)
| By Reach / Interconnect Length | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 | 2027 | 2028 | 2029 | 2030 | 2031 | 2032 | 2033 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Intra-package / intra-die (<10 mm) | XX.x | XX.x | XX.x | 0.66 | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Intra-rack / intra-chassis (10 mm–3 m) | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Inter-rack / data-hall (3 m–100 m) | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Total | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
Source: PIAnalysis Company Publications, Primary Interviews.
South East Asia Co-Packaged Optics (CPO) Market By End-Use Application 2025-2033 (USD Million)
| By End-Use Application | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 | 2027 | 2028 | 2029 | 2030 | 2031 | 2032 | 2033 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Hyperscale data centers (AI/cloud) | XX.x | XX.x | XX.x | 0.62 | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| AI-Driven High-Performance Computing (HPC) | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Enterprise data centers | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Telecom and metro networks | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Edge data centers | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Total | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
Source: PIAnalysis Company Publications, Primary Interviews.
South East Asia Co-Packaged Optics (CPO) Market By Distribution Channel 2025-2033 (USD Million)
| By Distribution Channel | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 | 2027 | 2028 | 2029 | 2030 | 2031 | 2032 | 2033 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Direct OEM / hyperscaler supply | XX.x | XX.x | XX.x | 0.74 | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Channel / distributor-based sales | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Contract manufacturing partnerships | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Total | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
Source: PIAnalysis Company Publications, Primary Interviews.