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LATAM Co-Packaged Optics (CPO) Market Size & Outlook, 2025-2033


LATAM Co-Packaged Optics (CPO) Market Insights

  • As per Packaging Market Insights, LATAM’s Co-Packaged Optics (CPO) Market was valued at USD 7.17 Million in 2024 and is anticipated to expand to USD 67.46 Million by 2033.
  • From 2026 to 2033, the market is anticipated to expand at a CAGR of 28.15%.
  • Within By Component, Optical engines/transceivers accounted for the largest market size in 2024.
  • During the forecast period, Optical engines/transceivers is anticipated to remain the highest-growth segment within the By Component category.

Other Key Findings


  • In 2024, LATAM contributed 7.56% to the overall global Co-Packaged Optics (CPO) Market size.
  • By 2033, United States is anticipated to dominate the global market based on market size.
  • Colombia is expected to witness the fastest growth within LATAM, attaining USD 5.46 Million by 2033.

Report Summary

Report Scope Details
Base Year for Study 2024
Study Period 2021-2033
Historical Period 2021-2023
Forecast Period 2025-2033
Market Size In 2024 USD 7.17 Million
Market Size In 2033 USD 67.46 Million
Largest segment Optical engines/transceivers
Units Revenue in USD Million
CAGR 28.15% (2025-2033)
Segmnetation Covered
LATAM
  1. Brazil
  2. Mexico
  3. Argentina
  4. Colombia
  5. Chile
By Component
  1. Optical engines/transceivers
  2. Photonic integrated circuits (PICs)
  3. Lasers
  4. Modulators
  5. Electrical ICs / SerDes
  6. Optical fibers and waveguides
  7. Connectors and interfaces
  8. Thermal management solutions
  9. Packaging substrates and interposers
  10. Testing and alignment tools
By Integration / Packaging Type
  1. True co-packaged optics (same package as ASIC)
  2. Co-located optics (adjacent module integration)
  3. On-board optics (PCB-level integration)
By Reach / Interconnect Length
  1. Intra-package / intra-die (<10 mm)
  2. Intra-rack / intra-chassis (10 mm–3 m)
  3. Inter-rack / data-hall (3 m–100 m)
By End-Use Application
  1. Hyperscale data centers (AI/cloud)
  2. AI-Driven High-Performance Computing (HPC)
  3. Enterprise data centers
  4. Telecom and metro networks
  5. Edge data centers
By Distribution Channel
  1. Direct OEM / hyperscaler supply
  2. Channel / distributor-based sales
  3. Contract manufacturing partnerships
Report Coverage Revenue Forecast, Competitive Landscape, Growth Factors, Environment & Regulatory Landscape and Trends

Tags:

Connected Packaging Temperature Monitoring

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