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Europe Co-Packaged Optics (CPO) Market Size & Outlook, 2025-2033


Europe Co-Packaged Optics (CPO) Market Insights

  • Based on Packaging Market Insights findings, the Europe Co-Packaged Optics (CPO) Market size reached USD 26.48 Million in 2024 and is expected to grow to USD 303.47 Million by 2033.
  • During 2026–2033, the market is forecasted to advance at a CAGR of 30.99%.
  • Optical engines/transceivers represented the largest share of the By Component market in terms of size in 2024.
  • Among the By Component segments, Thermal management solutions is forecasted to achieve the highest growth and remain the most lucrative through the forecast period.

Other Key Findings


  • In 2024, Europe accounted for 27.93% of the global Co-Packaged Optics (CPO) Market size.
  • By 2033, United States is projected to lead the global market in terms of market size.
  • Spain is projected to emerge as the fastest-growing market in Europe, reaching USD 27.32 Million by 2033.

Report Summary

Report Scope Details
Base Year for Study 2024
Study Period 2021-2033
Historical Period 2021-2023
Forecast Period 2025-2033
Market Size In 2024 USD 26.48 Million
Market Size In 2033 USD 303.47 Million
Largest segment Optical engines/transceivers
Units Revenue in USD Million
CAGR 30.99% (2025-2033)
Segmnetation Covered
Europe
  1. Germany
  2. United Kingdom
  3. France
  4. Italy
  5. Spain
  6. Russia
  7. Nordic
  8. Benelux
By Component
  1. Optical engines/transceivers
  2. Photonic integrated circuits (PICs)
  3. Lasers
  4. Modulators
  5. Electrical ICs / SerDes
  6. Optical fibers and waveguides
  7. Connectors and interfaces
  8. Thermal management solutions
  9. Packaging substrates and interposers
  10. Testing and alignment tools
By Integration / Packaging Type
  1. True co-packaged optics (same package as ASIC)
  2. Co-located optics (adjacent module integration)
  3. On-board optics (PCB-level integration)
By Reach / Interconnect Length
  1. Intra-package / intra-die (<10 mm)
  2. Intra-rack / intra-chassis (10 mm–3 m)
  3. Inter-rack / data-hall (3 m–100 m)
By End-Use Application
  1. Hyperscale data centers (AI/cloud)
  2. AI-Driven High-Performance Computing (HPC)
  3. Enterprise data centers
  4. Telecom and metro networks
  5. Edge data centers
By Distribution Channel
  1. Direct OEM / hyperscaler supply
  2. Channel / distributor-based sales
  3. Contract manufacturing partnerships
Report Coverage Revenue Forecast, Competitive Landscape, Growth Factors, Environment & Regulatory Landscape and Trends

Tags:

Connected Packaging Temperature Monitoring

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