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Australia Co-Packaged Optics (CPO) Market Size & Outlook, 2025-2033


Australia Co-Packaged Optics (CPO) Market Insights

  • According to Packaging Market Insights analysis, the Australia Co-Packaged Optics (CPO) Market size was USD 0.89 Million in 2024 and is projected to reach USD 10.16 Million by 2033.
  • The Australia market is projected to grow at a CAGR of 30.81% between 2026 and 2033.
  • By segment, Optical engines/transceivers emerged as the largest By Component in terms of market size in 2024.
  • Optical engines/transceivers is anticipated to remain the most attractive By Component segment, recording the fastest growth during the forecast period.

Other Key Findings


  • In 2024, Australia represented 0.94% of the overall global Co-Packaged Optics (CPO) Market size.
  • United States is projected to lead the global Co-Packaged Optics (CPO) Market size by 2033.
  • Across Asia Pacific, China is anticipated to hold the dominant position in market size by 2033.
  • Australia is forecasted to expand at the fastest pace in Asia Pacific, attaining USD 9.76 Million by 2033.

Report Summary

Report Scope Details
Base Year for Study 2024
Study Period 2021-2033
Historical Period 2021-2023
Forecast Period 2025-2033
Market Size In 2024 USD 0.89 Million
Market Size In 2033 USD 10.16 Million
Largest segment Optical engines/transceivers
Units Revenue in USD Million
CAGR 30.81% (2025-2033)
Segmnetation Covered
By Component
  1. Optical engines/transceivers
  2. Photonic integrated circuits (PICs)
  3. Lasers
  4. Modulators
  5. Electrical ICs / SerDes
  6. Optical fibers and waveguides
  7. Connectors and interfaces
  8. Thermal management solutions
  9. Packaging substrates and interposers
  10. Testing and alignment tools
By Integration / Packaging Type
  1. True co-packaged optics (same package as ASIC)
  2. Co-located optics (adjacent module integration)
  3. On-board optics (PCB-level integration)
By Reach / Interconnect Length
  1. Intra-package / intra-die (<10 mm)
  2. Intra-rack / intra-chassis (10 mm–3 m)
  3. Inter-rack / data-hall (3 m–100 m)
By End-Use Application
  1. Hyperscale data centers (AI/cloud)
  2. AI-Driven High-Performance Computing (HPC)
  3. Enterprise data centers
  4. Telecom and metro networks
  5. Edge data centers
By Distribution Channel
  1. Direct OEM / hyperscaler supply
  2. Channel / distributor-based sales
  3. Contract manufacturing partnerships
Report Coverage Revenue Forecast, Competitive Landscape, Growth Factors, Environment & Regulatory Landscape and Trends

Tags:

Connected Packaging Temperature Monitoring

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