Asia Pacific Co-Packaged Optics (CPO) Market Size & Outlook, 2025-2033
Asia Pacific Co-Packaged Optics (CPO) Market Insights
- According to Packaging Market Insights analysis, the Asia Pacific Co-Packaged Optics (CPO) Market size stood at USD 14.42 Million in 2024 and is forecasted to reach USD 139.1 Million by 2033.
- The market is projected to grow at a CAGR of 28.75% between 2026 and 2033.
- By segment, Optical engines/transceivers was the leading By Component in terms of market size in 2024.
- Photonic integrated circuits (PICs) is expected to be the most lucrative By Component segment, exhibiting the fastest growth throughout the forecast period.
Source: PIAnalysis Company Publications, Primary Interviews.
Other Key Findings
- In 2024, Asia Pacific contributed 15.21% to the overall global Co-Packaged Optics (CPO) Market size.
- By 2033, United States is anticipated to dominate the global market based on market size.
- Australia is expected to witness the fastest growth within Asia Pacific, attaining USD 9.76 Million by 2033.
Report Summary
| Report Scope | Details |
|---|---|
| Base Year for Study | 2024 |
| Study Period | 2021-2033 |
| Historical Period | 2021-2023 |
| Forecast Period | 2025-2033 |
| Market Size In 2024 | USD 14.42 Million |
| Market Size In 2033 | USD 139.1 Million |
| Largest segment | Optical engines/transceivers |
| Units | Revenue in USD Million |
| CAGR | 28.75% (2025-2033) |
| Segmnetation Covered | |
| Asia Pacific |
|
| By Component |
|
| By Integration / Packaging Type |
|
| By Reach / Interconnect Length |
|
| By End-Use Application |
|
| By Distribution Channel |
|
| Report Coverage | Revenue Forecast, Competitive Landscape, Growth Factors, Environment & Regulatory Landscape and Trends |
Asia Pacific Co-Packaged Optics (CPO) Market Country 2025-2033 (USD Million)
| Asia Pacific | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 | 2027 | 2028 | 2029 | 2030 | 2031 | 2032 | 2033 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| China | XX.x | XX.x | XX.x | 5.48 | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| India | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Japan | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Korea | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Taiwan | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Australia | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Singapore | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| South East Asia | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Total | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
Source: PIAnalysis Company Publications, Primary Interviews.
Asia Pacific Co-Packaged Optics (CPO) Market By Component 2025-2033 (USD Million)
| By Component | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 | 2027 | 2028 | 2029 | 2030 | 2031 | 2032 | 2033 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Optical engines/transceivers | XX.x | XX.x | XX.x | 3.55 | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Photonic integrated circuits (PICs) | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Lasers | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Modulators | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Electrical ICs / SerDes | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Optical fibers and waveguides | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Connectors and interfaces | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Thermal management solutions | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Packaging substrates and interposers | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Testing and alignment tools | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Total | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
Source: PIAnalysis Company Publications, Primary Interviews.
Asia Pacific Co-Packaged Optics (CPO) Market By Integration / Packaging Type 2025-2033 (USD Million)
| By Integration / Packaging Type | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 | 2027 | 2028 | 2029 | 2030 | 2031 | 2032 | 2033 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| True co-packaged optics (same package as ASIC) | XX.x | XX.x | XX.x | 6.49 | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Co-located optics (adjacent module integration) | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| On-board optics (PCB-level integration) | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Total | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
Source: PIAnalysis Company Publications, Primary Interviews.
Asia Pacific Co-Packaged Optics (CPO) Market By Reach / Interconnect Length 2025-2033 (USD Million)
| By Reach / Interconnect Length | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 | 2027 | 2028 | 2029 | 2030 | 2031 | 2032 | 2033 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Intra-package / intra-die (<10 mm) | XX.x | XX.x | XX.x | 6.5 | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Intra-rack / intra-chassis (10 mm–3 m) | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Inter-rack / data-hall (3 m–100 m) | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Total | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
Source: PIAnalysis Company Publications, Primary Interviews.
Asia Pacific Co-Packaged Optics (CPO) Market By End-Use Application 2025-2033 (USD Million)
| By End-Use Application | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 | 2027 | 2028 | 2029 | 2030 | 2031 | 2032 | 2033 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Hyperscale data centers (AI/cloud) | XX.x | XX.x | XX.x | 5.42 | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| AI-Driven High-Performance Computing (HPC) | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Enterprise data centers | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Telecom and metro networks | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Edge data centers | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Total | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
Source: PIAnalysis Company Publications, Primary Interviews.
Asia Pacific Co-Packaged Optics (CPO) Market By Distribution Channel 2025-2033 (USD Million)
| By Distribution Channel | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 | 2027 | 2028 | 2029 | 2030 | 2031 | 2032 | 2033 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Direct OEM / hyperscaler supply | XX.x | XX.x | XX.x | 6.88 | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Channel / distributor-based sales | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Contract manufacturing partnerships | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Total | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
Source: PIAnalysis Company Publications, Primary Interviews.