Japan Co-Packaged Optics (CPO) Market Size & Outlook, 2025-2033

Japan Co-Packaged Optics (CPO) Market Insights

As highlighted in Packaging Market Insights analysis, the Japan Co-Packaged Optics (CPO) Market, worth USD 1.89 Million in 2024, is forecasted to achieve USD 19.92 Million by 2033.
The Japan market is anticipated to grow at a CAGR of 29.71% during the period 2026–2033.
By 2024, Optical engines/transceivers represented the largest share of the By Component market size.
Optical fibers and waveguides is expected to remain the key growth driver within By Component, registering the fastest CAGR during the forecast period.

In 2024, Japan accounted for 1.99% of the global Co-Packaged Optics (CPO) Market size.
By 2033, United States is expected to lead the global Co-Packaged Optics (CPO) Market in terms of market size.
Within Asia Pacific, China is projected to dominate the regional Co-Packaged Optics (CPO) Market size by 2033.
Australia is identified as the fastest-growing market in Asia Pacific, anticipated to reach USD 9.76 Million by 2033.

Report Scope	Details
Base Year for Study	2024
Study Period	2021-2033
Historical Period	2021-2023
Forecast Period	2025-2033
Market Size In 2024	USD 1.89 Million
Market Size In 2033	USD 19.92 Million
Largest segment	Optical engines/transceivers
Units	Revenue in USD Million
CAGR	29.71% (2025-2033)
Segmnetation Covered
By Component	Optical engines/transceivers Photonic integrated circuits (PICs) Lasers Modulators Electrical ICs / SerDes Optical fibers and waveguides Connectors and interfaces Thermal management solutions Packaging substrates and interposers Testing and alignment tools
By Integration / Packaging Type	True co-packaged optics (same package as ASIC) Co-located optics (adjacent module integration) On-board optics (PCB-level integration)
By Reach / Interconnect Length	Intra-package / intra-die (<10 mm) Intra-rack / intra-chassis (10 mm–3 m) Inter-rack / data-hall (3 m–100 m)
By End-Use Application	Hyperscale data centers (AI/cloud) AI-Driven High-Performance Computing (HPC) Enterprise data centers Telecom and metro networks Edge data centers
By Distribution Channel	Direct OEM / hyperscaler supply Channel / distributor-based sales Contract manufacturing partnerships
Report Coverage	Revenue Forecast, Competitive Landscape, Growth Factors, Environment & Regulatory Landscape and Trends

By Component	2021	2022	2023	2024	2025	2026	2027	2028	2029	2030	2031	2032	2033
Optical engines/transceivers	XX.x	XX.x	XX.x	0.39	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Photonic integrated circuits (PICs)	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Lasers	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Modulators	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Electrical ICs / SerDes	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Optical fibers and waveguides	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Connectors and interfaces	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Thermal management solutions	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Packaging substrates and interposers	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Testing and alignment tools	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Total	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x

Source: PIAnalysis Company Publications, Primary Interviews.

By Integration / Packaging Type	2021	2022	2023	2024	2025	2026	2027	2028	2029	2030	2031	2032	2033
True co-packaged optics (same package as ASIC)	XX.x	XX.x	XX.x	0.95	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Co-located optics (adjacent module integration)	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
On-board optics (PCB-level integration)	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Total	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x

Source: PIAnalysis Company Publications, Primary Interviews.

By Reach / Interconnect Length	2021	2022	2023	2024	2025	2026	2027	2028	2029	2030	2031	2032	2033
Intra-package / intra-die (<10 mm)	XX.x	XX.x	XX.x	0.92	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Intra-rack / intra-chassis (10 mm–3 m)	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Inter-rack / data-hall (3 m–100 m)	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Total	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x

Source: PIAnalysis Company Publications, Primary Interviews.

By End-Use Application	2021	2022	2023	2024	2025	2026	2027	2028	2029	2030	2031	2032	2033
Hyperscale data centers (AI/cloud)	XX.x	XX.x	XX.x	0.66	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
AI-Driven High-Performance Computing (HPC)	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Enterprise data centers	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Telecom and metro networks	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Edge data centers	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Total	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x

Source: PIAnalysis Company Publications, Primary Interviews.

By Distribution Channel	2021	2022	2023	2024	2025	2026	2027	2028	2029	2030	2031	2032	2033
Direct OEM / hyperscaler supply	XX.x	XX.x	XX.x	1	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Channel / distributor-based sales	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Contract manufacturing partnerships	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Total	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x