Singapore Co-Packaged Optics (CPO) Market Size & Outlook, 2025-2033

Singapore Co-Packaged Optics (CPO) Market Insights

Packaging Market Insights analysis indicates that the Singapore Co-Packaged Optics (CPO) Market size, valued at USD 0.29 Million in 2024, is expected to expand to USD 2.71 Million by 2033.
The Singapore market is forecasted to expand at a CAGR of 28.27% spanning 2026–2033.
Optical engines/transceivers held the leading position among By Component segments in 2024, based on market size.
Electrical ICs / SerDes is projected to post the fastest growth rate, sustaining its position as the most attractive By Component segment during the forecast horizon.

As of 2024, Singapore held 0.31% of the global Co-Packaged Optics (CPO) Market size.
By 2033, United States is anticipated to capture the largest share of the global Co-Packaged Optics (CPO) Market.
In Asia Pacific, China is expected to lead the regional Co-Packaged Optics (CPO) Market size by 2033.
Australia will remain the fastest-growing market in Asia Pacific, reaching USD 9.76 Million by 2033.

Report Scope	Details
Base Year for Study	2024
Study Period	2021-2033
Historical Period	2021-2023
Forecast Period	2025-2033
Market Size In 2024	USD 0.29 Million
Market Size In 2033	USD 2.71 Million
Largest segment	Optical engines/transceivers
Units	Revenue in USD Million
CAGR	28.27% (2025-2033)
Segmnetation Covered
By Component	Optical engines/transceivers Photonic integrated circuits (PICs) Lasers Modulators Electrical ICs / SerDes Optical fibers and waveguides Connectors and interfaces Thermal management solutions Packaging substrates and interposers Testing and alignment tools
By Integration / Packaging Type	True co-packaged optics (same package as ASIC) Co-located optics (adjacent module integration) On-board optics (PCB-level integration)
By Reach / Interconnect Length	Intra-package / intra-die (<10 mm) Intra-rack / intra-chassis (10 mm–3 m) Inter-rack / data-hall (3 m–100 m)
By End-Use Application	Hyperscale data centers (AI/cloud) AI-Driven High-Performance Computing (HPC) Enterprise data centers Telecom and metro networks Edge data centers
By Distribution Channel	Direct OEM / hyperscaler supply Channel / distributor-based sales Contract manufacturing partnerships
Report Coverage	Revenue Forecast, Competitive Landscape, Growth Factors, Environment & Regulatory Landscape and Trends

By Component	2021	2022	2023	2024	2025	2026	2027	2028	2029	2030	2031	2032	2033
Optical engines/transceivers	XX.x	XX.x	XX.x	0.07	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Photonic integrated circuits (PICs)	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Lasers	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Modulators	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Electrical ICs / SerDes	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Optical fibers and waveguides	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Connectors and interfaces	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Thermal management solutions	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Packaging substrates and interposers	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Testing and alignment tools	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Total	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x

Source: PIAnalysis Company Publications, Primary Interviews.

By Integration / Packaging Type	2021	2022	2023	2024	2025	2026	2027	2028	2029	2030	2031	2032	2033
True co-packaged optics (same package as ASIC)	XX.x	XX.x	XX.x	0.16	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Co-located optics (adjacent module integration)	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
On-board optics (PCB-level integration)	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Total	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x

Source: PIAnalysis Company Publications, Primary Interviews.

By Reach / Interconnect Length	2021	2022	2023	2024	2025	2026	2027	2028	2029	2030	2031	2032	2033
Intra-package / intra-die (<10 mm)	XX.x	XX.x	XX.x	0.13	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Intra-rack / intra-chassis (10 mm–3 m)	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Inter-rack / data-hall (3 m–100 m)	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Total	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x

Source: PIAnalysis Company Publications, Primary Interviews.

By End-Use Application	2021	2022	2023	2024	2025	2026	2027	2028	2029	2030	2031	2032	2033
Hyperscale data centers (AI/cloud)	XX.x	XX.x	XX.x	0.1	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
AI-Driven High-Performance Computing (HPC)	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Enterprise data centers	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Telecom and metro networks	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Edge data centers	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Total	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x

Source: PIAnalysis Company Publications, Primary Interviews.

By Distribution Channel	2021	2022	2023	2024	2025	2026	2027	2028	2029	2030	2031	2032	2033
Direct OEM / hyperscaler supply	XX.x	XX.x	XX.x	0.15	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Channel / distributor-based sales	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Contract manufacturing partnerships	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x
Total	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x	XX.x