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Middle East And Africa Co-Packaged Optics (CPO) Market Size & Outlook, 2025-2033


Middle East And Africa Co-Packaged Optics (CPO) Market Insights

  • As highlighted in Packaging Market Insights analysis, the Middle East And Africa Co-Packaged Optics (CPO) Market, valued at USD 10.37 Million in 2024, is estimated to achieve USD 97.59 Million by 2033.
  • The market is estimated to grow at a CAGR of 27.97% spanning 2026 to 2033.
  • By market size, Optical engines/transceivers led the By Component category in 2024.
  • The By Component segment led by Lasers is estimated to post the fastest growth, sustaining its position as the most lucrative during the forecast timeframe.

Other Key Findings


  • Middle East And Africa represented 10.94% of the global Co-Packaged Optics (CPO) Market size in 2024.
  • By 2033, United States is estimated to hold the largest position in the global market in terms of size.
  • Turkey is estimated to remain the fastest-growing market in Middle East and Africa, advancing to USD 8.05 Million by 2033.

Report Summary

Report Scope Details
Base Year for Study 2024
Study Period 2021-2033
Historical Period 2021-2023
Forecast Period 2025-2033
Market Size In 2024 USD 10.37 Million
Market Size In 2033 USD 97.59 Million
Largest segment Optical engines/transceivers
Units Revenue in USD Million
CAGR 27.97% (2025-2033)
Segmnetation Covered
Middle East and Africa
  1. United Arab Emirates
  2. Saudi Arabia
  3. South Africa
  4. Egypt
  5. Nigeria
  6. Turkey
By Component
  1. Optical engines/transceivers
  2. Photonic integrated circuits (PICs)
  3. Lasers
  4. Modulators
  5. Electrical ICs / SerDes
  6. Optical fibers and waveguides
  7. Connectors and interfaces
  8. Thermal management solutions
  9. Packaging substrates and interposers
  10. Testing and alignment tools
By Integration / Packaging Type
  1. True co-packaged optics (same package as ASIC)
  2. Co-located optics (adjacent module integration)
  3. On-board optics (PCB-level integration)
By Reach / Interconnect Length
  1. Intra-package / intra-die (<10 mm)
  2. Intra-rack / intra-chassis (10 mm–3 m)
  3. Inter-rack / data-hall (3 m–100 m)
By End-Use Application
  1. Hyperscale data centers (AI/cloud)
  2. AI-Driven High-Performance Computing (HPC)
  3. Enterprise data centers
  4. Telecom and metro networks
  5. Edge data centers
By Distribution Channel
  1. Direct OEM / hyperscaler supply
  2. Channel / distributor-based sales
  3. Contract manufacturing partnerships
Report Coverage Revenue Forecast, Competitive Landscape, Growth Factors, Environment & Regulatory Landscape and Trends

Tags:

Connected Packaging Temperature Monitoring

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