Taiwan Organic Substrate Packaging Materials Market, By By Technology 2026-2034(USD Million)
2025 Market Share
| Segment | 2022 | 2023 | 2024 | 2025 | 2026 | 2027 | 2028 | 2029 | 2030 | 2031 | 2032 | 2033 | 2034 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Small Thin Outline Packages | 5.96 | ||||||||||||
| Pin Grid Array (PGA) Packages | 4.01 | ||||||||||||
| Flat no-leads Packages | 3.35 | ||||||||||||
| Quad Flat Package (QFP) | 2.18 | ||||||||||||
| Dual Inline Package (DIP) | 1.47 | ||||||||||||
| Total | 16.97 |