Argentina Organic Substrate Packaging Materials Market, By By Technology 2026-2034(USD Million)
2025 Market Share
| Segment | 2022 | 2023 | 2024 | 2025 | 2026 | 2027 | 2028 | 2029 | 2030 | 2031 | 2032 | 2033 | 2034 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Small Thin Outline Packages | 3.96 | ||||||||||||
| Pin Grid Array (PGA) Packages | 2.04 | ||||||||||||
| Flat no-leads Packages | 1.66 | ||||||||||||
| Quad Flat Package (QFP) | 1.05 | ||||||||||||
| Dual Inline Package (DIP) | 0.48 | ||||||||||||
| Total | 9.19 |