Canada Organic Substrate Packaging Materials Market, By By Technology 2026-2034(USD Million)
2025 Market Share
| Segment | 2022 | 2023 | 2024 | 2025 | 2026 | 2027 | 2028 | 2029 | 2030 | 2031 | 2032 | 2033 | 2034 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Small Thin Outline Packages | 56.65 | ||||||||||||
| Pin Grid Array (PGA) Packages | 31.08 | ||||||||||||
| Flat no-leads Packages | 21.90 | ||||||||||||
| Quad Flat Package (QFP) | 13.05 | ||||||||||||
| Dual Inline Package (DIP) | 7.08 | ||||||||||||
| Total | 129.76 |