United States Advanced Packaging Market Size & Outlook, 2026-2034
United States Advanced Packaging Market Insights
- As per Packaging Market Insights, the United States Advanced Packaging Market stood at USD 10480.36 Million in 2025 and is anticipated to grow to USD 20796.75 Million by 2034.
- The United States market is expected to advance at a CAGR of 7.89% from 2026 through 2034.
- In 2025, Flip Chip CSP accounted for the highest share of the By Type market size.
- During the forecast period, Wafer Level CSP is set to register the highest growth, making it the most lucrative By Type segment.
Source: PIAnalysis Company Publications, Primary Interviews.
Other Key Findings
- In 2025, United States accounted for 26.51% of the global Advanced Packaging Market size.
- By 2034, United States is expected to lead the global Advanced Packaging Market in terms of market size.
- Within North America, United States is projected to dominate the regional Advanced Packaging Market size by 2034.
- Canada is identified as the fastest-growing market in North America, anticipated to reach USD 5631.77 Million by 2034.
Report Summary
| Report Scope | Details |
|---|---|
| Base Year for Study | 2025 |
| Study Period | 2021-2034 |
| Historical Period | 2021-2024 |
| Forecast Period | 2026-2034 |
| Market Size In 2025 | USD 10480.36 Million |
| Market Size In 2034 | USD 20796.75 Million |
| Largest segment | Flip Chip CSP |
| Units | Revenue in USD Million |
| CAGR | 7.89% (2026-2034) |
| Segmnetation Covered | |
| By Type |
|
| By End-use |
|
| Report Coverage | Revenue Forecast, Competitive Landscape, Growth Factors, Environment & Regulatory Landscape and Trends |
United States Advanced Packaging Market By Type 2026-2034 (USD Million)
| By Type | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 | 2027 | 2028 | 2029 | 2030 | 2031 | 2032 | 2033 | 2034 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Flip Chip CSP | XX.x | XX.x | XX.x | 3310.76 | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Flip-Chip Ball Grid Array | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Wafer Level CSP | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| 5D/3D | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Fan Out WLP | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Others | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Total | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
Source: PIAnalysis Company Publications, Primary Interviews.
United States Advanced Packaging Market By End-use 2026-2034 (USD Million)
| By End-use | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 | 2027 | 2028 | 2029 | 2030 | 2031 | 2032 | 2033 | 2034 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Consumer Electronics | XX.x | XX.x | XX.x | 2956.27 | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Automotive | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Industrial | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Healthcare | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Aerospace & Defense | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Others | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Total | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
Source: PIAnalysis Company Publications, Primary Interviews.