Mexico Advanced Packaging Market Size & Outlook, 2026-2034
Mexico Advanced Packaging Market Insights
- According to Packaging Market Insights analysis, the Mexico Advanced Packaging Market size was USD 672.08 Million in 2025 and is projected to reach USD 1347.09 Million by 2034.
- The Mexico market is projected to grow at a CAGR of 8.12% between 2026 and 2034.
- By segment, Flip Chip CSP emerged as the largest By Type in terms of market size in 2025.
- Others is anticipated to remain the most attractive By Type segment, recording the fastest growth during the forecast period.
Source: PIAnalysis Company Publications, Primary Interviews.
Other Key Findings
- In 2025, Mexico represented 1.7% of the overall global Advanced Packaging Market size.
- United States is projected to lead the global Advanced Packaging Market size by 2034.
- Across LATAM, Brazil is anticipated to hold the dominant position in market size by 2034.
- Mexico is forecasted to expand at the fastest pace in LATAM, attaining USD 1356.99 Million by 2034.
Report Summary
| Report Scope | Details |
|---|---|
| Base Year for Study | 2025 |
| Study Period | 2021-2034 |
| Historical Period | 2021-2024 |
| Forecast Period | 2026-2034 |
| Market Size In 2025 | USD 672.08 Million |
| Market Size In 2034 | USD 1347.09 Million |
| Largest segment | Flip Chip CSP |
| Units | Revenue in USD Million |
| CAGR | 8.12% (2026-2034) |
| Segmnetation Covered | |
| By Type |
|
| By End-use |
|
| Report Coverage | Revenue Forecast, Competitive Landscape, Growth Factors, Environment & Regulatory Landscape and Trends |
Mexico Advanced Packaging Market By Type 2026-2034 (USD Million)
| By Type | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 | 2027 | 2028 | 2029 | 2030 | 2031 | 2032 | 2033 | 2034 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Flip Chip CSP | XX.x | XX.x | XX.x | 193.19 | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Flip-Chip Ball Grid Array | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Wafer Level CSP | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| 5D/3D | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Fan Out WLP | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Others | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Total | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
Source: PIAnalysis Company Publications, Primary Interviews.
Mexico Advanced Packaging Market By End-use 2026-2034 (USD Million)
| By End-use | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 | 2027 | 2028 | 2029 | 2030 | 2031 | 2032 | 2033 | 2034 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Consumer Electronics | XX.x | XX.x | XX.x | 186.21 | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Automotive | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Industrial | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Healthcare | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Aerospace & Defense | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Others | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Total | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
Source: PIAnalysis Company Publications, Primary Interviews.