South Korea Advanced Packaging Market Size & Outlook, 2026-2034
South Korea Advanced Packaging Market Insights
- Packaging Market Insights analysis indicates that the South Korea Advanced Packaging Market size, valued at USD 763.55 Million in 2025, is expected to expand to USD 1481.3 Million by 2034.
- The South Korea market is forecasted to expand at a CAGR of 7.59% spanning 2026–2034.
- Flip Chip CSP held the leading position among By Type segments in 2025, based on market size.
- Flip-Chip Ball Grid Array is projected to post the fastest growth rate, sustaining its position as the most attractive By Type segment during the forecast horizon.
Source: PIAnalysis Company Publications, Primary Interviews.
Other Key Findings
- In 2025, South Korea represented 1.93% of the overall global Advanced Packaging Market size.
- United States is projected to lead the global Advanced Packaging Market size by 2034.
- Across Asia Pacific, China is anticipated to hold the dominant position in market size by 2034.
- India is forecasted to expand at the fastest pace in Asia Pacific, attaining USD 4812.33 Million by 2034.
Report Summary
| Report Scope | Details |
|---|---|
| Base Year for Study | 2025 |
| Study Period | 2021-2034 |
| Historical Period | 2021-2024 |
| Forecast Period | 2026-2034 |
| Market Size In 2025 | USD 763.55 Million |
| Market Size In 2034 | USD 1481.3 Million |
| Largest segment | Flip Chip CSP |
| Units | Revenue in USD Million |
| CAGR | 7.59% (2026-2034) |
| Segmnetation Covered | |
| By Type |
|
| By End-use |
|
| Report Coverage | Revenue Forecast, Competitive Landscape, Growth Factors, Environment & Regulatory Landscape and Trends |
South Korea Advanced Packaging Market By Type 2026-2034 (USD Million)
| By Type | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 | 2027 | 2028 | 2029 | 2030 | 2031 | 2032 | 2033 | 2034 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Flip Chip CSP | XX.x | XX.x | XX.x | 239.87 | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Flip-Chip Ball Grid Array | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Wafer Level CSP | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| 5D/3D | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Fan Out WLP | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Others | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Total | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
Source: PIAnalysis Company Publications, Primary Interviews.
South Korea Advanced Packaging Market By End-use 2026-2034 (USD Million)
| By End-use | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 | 2027 | 2028 | 2029 | 2030 | 2031 | 2032 | 2033 | 2034 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Consumer Electronics | XX.x | XX.x | XX.x | 214.61 | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Automotive | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Industrial | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Healthcare | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Aerospace & Defense | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Others | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
| Total | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x | XX.x |
Source: PIAnalysis Company Publications, Primary Interviews.